Precise Deposition of Thin Films using Electrochemical Atomic Layer Deposition: Applications in Energy Storage, Catalysis, and Microelectronics

Abstract

This research investigates the application of Electrochemical Atomic Layer Deposition (E-ALD) technique for thin-film deposition in various fields. The study finds that E-ALD provides precise control over the deposition of thin films, which can significantly enhance the performance and stability of various devices. The results indicate that E-ALD can be applied for energy storage, corrosion protection, catalysis, optoelectronics, and microelectronics. Specifically, the research demonstrates that E-ALD can be utilized to deposit thin films of electrode materials for energy storage applications, providing uniform and continuous coverage to enhance device performance and stability. Moreover, E-ALD can be used to deposit thin films of corrosion-resistant materials on metal substrates for effective corrosion protection. Additionally, the study shows that E-ALD can deposit thin films of catalytic materials, which significantly improve the catalytic activity and selectivity of these materials. E-ALD also demonstrates potential for use in optoelectronic devices, such as solar cells and light-emitting diodes, to improve device performance and stability. Lastly, E-ALD can deposit thin films of materials for use in microelectronics, such as thin-film transistors and capacitors, improving their performance and reliability. These findings highlight the potential of E-ALD as a versatile technique for precise deposition of thin films in various fields.